Invention Grant
US08367945B2 Apparatus, system and method for use in mounting electronic elements 有权
用于安装电子元件的装置,系统和方法

Apparatus, system and method for use in mounting electronic elements
Abstract:
The present embodiments provide apparatuses, systems and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices that comprise a casing comprising a recess formed in the casing and extending into the casing, an insert secured with the casing and extending about the recess defining a portion of a surface of the recess with the insert comprising a reflective surface exposed along the recess, and a plurality of leads partially exposed through the recess.
Information query
Patent Agency Ranking
0/0