Invention Grant
US08367981B2 Baking apparatus, baking method and method of reducing gap width
有权
烘烤设备,烘烤方法和减少间隙宽度的方法
- Patent Title: Baking apparatus, baking method and method of reducing gap width
- Patent Title (中): 烘烤设备,烘烤方法和减少间隙宽度的方法
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Application No.: US12121347Application Date: 2008-05-15
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Publication No.: US08367981B2Publication Date: 2013-02-05
- Inventor: Chin-Cheng Yang
- Applicant: Chin-Cheng Yang
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX International Co., Ltd.
- Current Assignee: MACRONIX International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H05B3/68
- IPC: H05B3/68

Abstract:
A baking apparatus including a hot plate and a substrate rotation member is provided. The hot plate has a heating surface. The substrate rotation member includes a rotation ring and a plurality of support arms. The rotation ring is configured to surround the hot plate. The support arms are disposed over the heating surface of the hot plate. Each of the support arms includes a connection part and a support part, wherein the connection part is configured to connect the rotation ring and the support part, and a supporting surface of the support part for supporting the substrate is higher than the heating surface of the hot plate.
Public/Granted literature
- US20090286407A1 BAKING APPARATUS, BAKING MEHOD AND METHOD OF REDUCING GAP WIDTH Public/Granted day:2009-11-19
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