Embodiments of the invention relates to a metal thin film connection structure, comprising a first metal layer pattern; a second metal layer pattern which is separately disposed with the first metal layer pattern; a first insulating layer formed on the first metal layer pattern and the second metal layer pattern; a plurality of first via holes formed over the first metal layer pattern; a plurality of second via holes formed over the second metal layer pattern; and a plurality of third metal layer patterns formed on the first insulating layer, the third metal layer patterns being filled in the first via holes and the second via holes and electrically connect the first metal layer pattern and the second metal layer pattern through the first and second via holes. The embodiments of the invention also provide an array substrate comprising the metal thin film connection structure and a manufacturing method for the metal thin film connection structure.