Invention Grant
US08368150B2 High performance IC chip having discrete decoupling capacitors attached to its IC surface
有权
具有分立去耦电容器的高性能IC芯片连接到其IC表面
- Patent Title: High performance IC chip having discrete decoupling capacitors attached to its IC surface
- Patent Title (中): 具有分立去耦电容器的高性能IC芯片连接到其IC表面
-
Application No.: US10802566Application Date: 2004-03-17
-
Publication No.: US08368150B2Publication Date: 2013-02-05
- Inventor: Mou-Shiung Lin
- Applicant: Mou-Shiung Lin
- Applicant Address: TW Hsinchu
- Assignee: Megica Corporation
- Current Assignee: Megica Corporation
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L27/11
- IPC: H01L27/11
Abstract:
In the present invention, discrete decoupling capacitors are mounted on the surface of an IC chip. Since a discrete capacitor can provide the capacitance of the magnitude μF, the attached capacitors can serve as the local power reservoir to decouple the external power ground noise caused by wirebonds, packages, and other system components.
Public/Granted literature
- US20040183209A1 High performance IC chip having discrete decoupling capacitors attached to its IC surface Public/Granted day:2004-09-23
Information query
IPC分类:
