Invention Grant
- Patent Title: Semiconductor device having a device isolation structure
- Patent Title (中): 具有器件隔离结构的半导体器件
-
Application No.: US12897095Application Date: 2010-10-04
-
Publication No.: US08368169B2Publication Date: 2013-02-05
- Inventor: Seunguk Han , Satoru Yamada , Young Jin Choi
- Applicant: Seunguk Han , Satoru Yamada , Young Jin Choi
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2009-0109152 20091112
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
An example semiconductor device includes a trench formed in a semiconductor substrate to define an active region, a filling dielectric layer provided within the trench, an oxide layer provided between the filling dielectric layer and the trench, a nitride layer provided between the oxide layer and the filling dielectric layer, and a barrier layer provided between the oxide layer and the nitride layer.
Public/Granted literature
- US20110108962A1 SEMICONDUCTOR DEVICE HAVING A DEVICE ISOLATION STRUCTURE Public/Granted day:2011-05-12
Information query
IPC分类: