Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US13157020Application Date: 2011-06-09
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Publication No.: US08368176B2Publication Date: 2013-02-05
- Inventor: Takayuki Iwaki , Takamasa Itou , Kana Shimizu
- Applicant: Takayuki Iwaki , Takamasa Itou , Kana Shimizu
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-133356 20100610
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
A lower electrode includes a metal-containing oxide layer having a thickness of 2 nm or less on the surface layer. A metal-containing oxide layer is formed by oxidizing the surface of the lower electrode. A dielectric film includes a first phase appearing at room temperature in the bulk state and a second phase appearing at a higher temperature than that in the first phase in the bulk state. The second phase has a higher relative permittivity than that of the first phase.
Public/Granted literature
- US20110304017A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2011-12-15
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