Invention Grant
- Patent Title: Chip package
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Application No.: US13236507Application Date: 2011-09-19
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Publication No.: US08368193B2Publication Date: 2013-02-05
- Inventor: Mou-Shiung Lin , Shih-Hsiung Lin , Hsin-Jung Lo
- Applicant: Mou-Shiung Lin , Shih-Hsiung Lin , Hsin-Jung Lo
- Applicant Address: TW Hsinchu
- Assignee: Megica Corporation
- Current Assignee: Megica Corporation
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Priority: TW94118540A 20050606
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A chip package includes a bump connecting said semiconductor chip and said circuitry component, wherein the semiconductor chip has a photosensitive area used to sense light. The chip package may include a ring-shaped protrusion connecting a transparent substrate and the semiconductor chip.
Public/Granted literature
- US20120007237A1 CHIP PACKAGE Public/Granted day:2012-01-12
Information query
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