Invention Grant
US08368211B2 Solderable top metalization and passivation for source mounted package 有权
可焊顶级金属化和源极安装封装的钝化

Solderable top metalization and passivation for source mounted package
Abstract:
A silver-containing solderable contact on a semiconductor die has its outer edge spaced from the confronting edge of an epoxy passivation layer so that, after soldering, silver ions are not present and are not therefor free to migrate under the epoxy layer to form dendrites.
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