Invention Grant
US08368211B2 Solderable top metalization and passivation for source mounted package
有权
可焊顶级金属化和源极安装封装的钝化
- Patent Title: Solderable top metalization and passivation for source mounted package
- Patent Title (中): 可焊顶级金属化和源极安装封装的钝化
-
Application No.: US10982965Application Date: 2004-11-05
-
Publication No.: US08368211B2Publication Date: 2013-02-05
- Inventor: Martin Standing , Andrew Sawle , Matthew P Elwin , David P Jones , Martin Carroll , Ian Glenville Wagstaffe
- Applicant: Martin Standing , Andrew Sawle , Matthew P Elwin , David P Jones , Martin Carroll , Ian Glenville Wagstaffe
- Applicant Address: US CA El Segundo
- Assignee: International Rectifier Corporation
- Current Assignee: International Rectifier Corporation
- Current Assignee Address: US CA El Segundo
- Agency: Farjami & Farjami LLP
- Main IPC: H01L27/095
- IPC: H01L27/095

Abstract:
A silver-containing solderable contact on a semiconductor die has its outer edge spaced from the confronting edge of an epoxy passivation layer so that, after soldering, silver ions are not present and are not therefor free to migrate under the epoxy layer to form dendrites.
Public/Granted literature
- US20050200011A1 Solderable top metalization and passivation for source mounted package Public/Granted day:2005-09-15
Information query
IPC分类: