Invention Grant
US08368217B2 Integrated circuit package with segregated Tx and Rx data channels
有权
集成电路封装,具有隔离的Tx和Rx数据通道
- Patent Title: Integrated circuit package with segregated Tx and Rx data channels
- Patent Title (中): 集成电路封装,具有隔离的Tx和Rx数据通道
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Application No.: US13541658Application Date: 2012-07-03
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Publication No.: US08368217B2Publication Date: 2013-02-05
- Inventor: Michael J. Miller , Mark William Baumann , Richard S. Roy
- Applicant: Michael J. Miller , Mark William Baumann , Richard S. Roy
- Applicant Address: US CA Santa Clara
- Assignee: MoSys, Inc.
- Current Assignee: MoSys, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: MoSys Legal Dept.
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
A chip layout isolates Rx terminals and Rx ports from Tx terminals and Tx ports. Tx terminals are grouped contiguously to each other, and are segregated as a group to a given edge of the package, Rx terminals are similarly grouped and segregated to a different edge of the package. Tx and Rx data channels are disposed in a respective single layer of the package, or both are disposed in a same single layer of the package. Rx ports and Tx ports are located at an approximate center of the package, with Tx and Rx ports disposed on respective opposite sides of an axis bisecting the package. Data signals received by, and transmitted from, the chip flow in a same direction, from a first edge of the package to the center of the package and from the center of the package to a second edge of the package, respectively.
Public/Granted literature
- US20120267769A1 INTEGRATED CIRCUIT PACKAGE WITH SEGREGATED TX AND RX DATA CHANNELS Public/Granted day:2012-10-25
Information query
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