Invention Grant
- Patent Title: Adhesive flexible barrier film, method of forming same, and organic electronic device including same
- Patent Title (中): 粘合柔性阻挡膜，其形成方法和包括其的有机电子器件
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Application No.: US13144395Application Date: 2010-01-13
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Publication No.: US08368218B2Publication Date: 2013-02-05
- Inventor: John Donald Blizzard , William Kenneth Weidner
- Applicant: John Donald Blizzard , William Kenneth Weidner
- Applicant Address: US MI Midland
- Assignee: Dow Corning Corporation
- Current Assignee: Dow Corning Corporation
- Current Assignee Address: US MI Midland
- Agency: Howard & Howard Attorneys PLLC
- International Application: PCT/US2010/020933 WO 20100113
- International Announcement: WO2010/083242 WO 20100722
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
An adhesive flexible barrier film comprises a substrate and a barrier layer disposed on the substrate. The barrier layer is formed from a barrier composition comprising an organosilicon compound. The adhesive flexible barrier film also comprises an adhesive layer disposed on the barrier layer and formed from an adhesive composition. A method of forming the adhesive flexible barrier film comprises the steps of disposing the barrier composition on the substrate to form the barrier layer, disposing the adhesive composition on the barrier layer to form the adhesive layer, and curing the barrier layer and the adhesive layer. The adhesive flexible barrier film may be utilized in organic electronic devices.
Public/Granted literature
- US20110272827A1 Adhesive Flexible Barrier Film, Method Of Forming Same, And Organic Electronic Device Including Same Public/Granted day:2011-11-10
Information query
IPC分类:
