Invention Grant
- Patent Title: Die power structure
- Patent Title (中): 电源结构
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Application No.: US13412513Application Date: 2012-03-05
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Publication No.: US08368226B2Publication Date: 2013-02-05
- Inventor: Aparna Ramachandran , Gary John Formica
- Applicant: Aparna Ramachandran , Gary John Formica
- Applicant Address: US CA Redwood City
- Assignee: Oracle International Corporation
- Current Assignee: Oracle International Corporation
- Current Assignee Address: US CA Redwood City
- Agency: Osha Liang LLP
- Main IPC: G11C5/14
- IPC: G11C5/14 ; H01L21/768 ; H01L23/485
Abstract:
A die including a first set of power tiles arranged in a first array and having a first voltage; a second set of power tiles arranged in a second array offset from the first array and having a second voltage; a set of power mesh segments enclosed by the second set of power tiles and having the first voltage; a first power rail passing underneath the set of power mesh segments and the first set of power tiles; and a set of vias operatively connecting the power rail with the set of power mesh segments and the first plurality of power tiles.
Public/Granted literature
- US20120161856A1 DIE POWER STRUCTURE Public/Granted day:2012-06-28
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