Invention Grant
US08368414B2 Method and apparatus for controlling position of Z-axis for wafer prober 有权
用于控制晶圆探针Z轴位置的方法和装置

  • Patent Title: Method and apparatus for controlling position of Z-axis for wafer prober
  • Patent Title (中): 用于控制晶圆探针Z轴位置的方法和装置
  • Application No.: US12743970
    Application Date: 2008-07-22
  • Publication No.: US08368414B2
    Publication Date: 2013-02-05
  • Inventor: Young-Ho Ko
  • Applicant: Young-Ho Ko
  • Applicant Address: KR
  • Assignee: Semics Inc.
  • Current Assignee: Semics Inc.
  • Current Assignee Address: KR
  • Agency: Cantor Colburn LLP
  • Priority: KR10-2007-0119916 20071122
  • International Application: PCT/KR2008/004266 WO 20080722
  • International Announcement: WO2009/066852 WO 20090528
  • Main IPC: G01R31/00
  • IPC: G01R31/00
Method and apparatus for controlling position of Z-axis for wafer prober
Abstract:
An apparatus for controlling the Z axis position of a wafer prober includes a first sensor unit including a plurality of pressure sensors distributed and installed between a Z axis support plate, for supporting a Z axis transferring unit and a Z axis base. Actuators are distributed and installed between the Z axis support plate and the Z axis base, and lift up or lower the Z axis support plate. A driving unit drives the actuators. A control module controls the driving unit to drive the actuators in response to pieces of sensed data. The control module drives the actuators when a difference between the pieces of sensed data is greater than a preset difference limit value, thus enabling the chuck plate to be maintained in a horizontal state.
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