Invention Grant
- Patent Title: Electromagnetic bandgap structure and printed circuit board
- Patent Title (中): 电磁带隙结构和印刷电路板
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Application No.: US12155941Application Date: 2008-06-11
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Publication No.: US08368488B2Publication Date: 2013-02-05
- Inventor: Han Kim , Hyung-Sik Choi , Sang-Hoon Kim , Joon-Sung Kim
- Applicant: Han Kim , Hyung-Sik Choi , Sang-Hoon Kim , Joon-Sung Kim
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0061834 20070622
- Main IPC: H01P1/203
- IPC: H01P1/203

Abstract:
An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.
Public/Granted literature
- US20080314634A1 Electromagnetic bandgap structure and printed circuit board Public/Granted day:2008-12-25
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