A method for manufacturing a patterned thin film layer on an uneven substrate is provided. The substrate having an outer surface and an inner surface. The method includes creating a cavity on the inner surface of the substrate, the cavity creating a cavity surface on a different plane as compared to the inner surface and a step between the cavity surface and the inner surface; forming a thin film layer on the inner surface of the substrate covering at least a part of the cavity surface, the step and the inner surface; performing laser ablation on the thin film layer to create patterns, at least some of which are created on the cavity surface, the step and the inner surface.