A thermal head includes a substrate main body including a flat plate-shaped support substrate and a flat plate-shaped upper substrate which are bonded to each other in a stacked state. A rectangular heating resistor is formed on a surface of the flat plate-shaped upper substrate. A bonding surface of the flat plate-shaped support substrate includes a concave portion that forms a cavity portion in a region opposed to the rectangular heating resistor and the concave portion includes a groove formed in an inner wall thereof and recessed along a depth direction of the concave portion within a range of a width of the rectangular heating resistor. The thermal head is capable of enhancing heat-insulating performance while maintaining mechanical strength of the upper substrate.