Invention Grant
US08368784B2 Solid-state imaging device, method of manufacturing the same, and electronic apparatus 有权
固态成像装置及其制造方法以及电子装置

  • Patent Title: Solid-state imaging device, method of manufacturing the same, and electronic apparatus
  • Patent Title (中): 固态成像装置及其制造方法以及电子装置
  • Application No.: US12836741
    Application Date: 2010-07-15
  • Publication No.: US08368784B2
    Publication Date: 2013-02-05
  • Inventor: Tetsuji Yamaguchi
  • Applicant: Tetsuji Yamaguchi
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: SNR Denton US LLP
  • Priority: JP2009-172383 20090723
  • Main IPC: H04N5/335
  • IPC: H04N5/335
Solid-state imaging device, method of manufacturing the same, and electronic apparatus
Abstract:
A solid-state imaging device includes: a light incident side; a circuit formation surface being opposite to the light incident side; and an inorganic photoelectric conversion unit having a pn junction and an organic photoelectric conversion unit including an organic photoelectric conversion layer, which are laminated in the same pixel in a depth direction from the light incident side and on which light is incident without passing through a color filter. Signals of the inorganic photoelectric conversion unit and the organic photoelectric conversion unit are read on the circuit formation surface.
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