A grounding mechanism is used for an electronic device. The electronic device includes a liquid crystal module and a housing. The grounding mechanism includes a first conductive element, a second conductive element and an elastic member. The first conductive element is attached to the liquid crystal module. The second conductive element is attached to the housing. The elastic member includes a main base, a resisting portion and a latching portion. The main base is received in the housing. The resisting portion is electronically connected to the second conductive element. The latching portion is electronically connected to the first conductive element.