Invention Grant
- Patent Title: Method and system for hybrid integration of an opto-electronic integrated circuit
- Patent Title (中): 光电集成电路混合集成方法与系统
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Application No.: US13076205Application Date: 2011-03-30
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Publication No.: US08368995B2Publication Date: 2013-02-05
- Inventor: John Dallesasse , Stephen B. Krasulick , William Kozlovsky
- Applicant: John Dallesasse , Stephen B. Krasulick , William Kozlovsky
- Applicant Address: US NM Albuquerque
- Assignee: Skorpios Technologies, Inc.
- Current Assignee: Skorpios Technologies, Inc.
- Current Assignee Address: US NM Albuquerque
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: G02F1/01
- IPC: G02F1/01 ; H04B10/12 ; G02B6/26

Abstract:
An opto-electronic integrated circuit (OEIC) includes an SOI substrate, a set of composite optical transmitters, a set of composite optical receivers, and control electronics disposed in the substrate and electrically coupled to the set of composite optical transmitters and receivers. Each of the composite optical transmitters includes a gain medium including a compound semiconductor material and an optical modulator. Each of the composite optical receivers includes a waveguide disposed in the SOI substrate, an optical detector bonded to the SOI substrate, and a bonding region disposed between the SOI substrate and the optical detector. The bonding region includes a metal-assisted bond at a first portion of the bonding region and a direct semiconductor-semiconductor bond at a second portion of the bonding region. The OEIC also includes control electronics disposed in the SOI substrate and electrically coupled to the set of composite optical transmitters and the set of composite optical receivers.
Public/Granted literature
- US20110267676A1 METHOD AND SYSTEM FOR HYBRID INTEGRATION OF AN OPTO-ELECTRONIC INTEGRATED CIRCUIT Public/Granted day:2011-11-03
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