A thin film magnetic head includes a magnetoresistive (MR) stack disposed between first and second shield layers in a direction orthogonal to the film surface; a first exchange-coupling layer that is positioned between the MR stack and the first shield layer; a second exchange-coupling layer that is positioned between the MR stack and the second shield layer; a bias magnetic field application layer that is disposed at an opposite surface of the MR stack from an air bearing surface (ABS); and pair of side shield layers that are positioned at both sides of the MR stack with respect to a track width direction. Each of the side shield layers includes a pair of magnetic layers that are antiferromagnetically exchange-coupled through a side shield ruthenium layer.