Invention Grant
- Patent Title: Relay connection
- Patent Title (中): 继电器连接
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Application No.: US12346924Application Date: 2008-12-31
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Publication No.: US08369060B2Publication Date: 2013-02-05
- Inventor: Remigius Wodniok
- Applicant: Remigius Wodniok
- Applicant Address: DE Seligenstadt
- Assignee: Schneider Electric Automation GmbH
- Current Assignee: Schneider Electric Automation GmbH
- Current Assignee Address: DE Seligenstadt
- Agency: Ladas & Parry LLP
- Priority: DE102008002758 20080125
- Main IPC: H01H47/00
- IPC: H01H47/00

Abstract:
A relay connection with at least two relays (K1, K2) connected in series or in parallel to a supply voltage (UV). In order to achieve a defined relay cut-out sequence should there be a dip in the supply voltage and consequently to increase safety, it is provided that the relays (K1, K2) have different minimum holding voltages (UHalt,min1; UHalt,min2) and/or inductive resistances (Rsp1; Rsp2).
Public/Granted literature
- US20090190282A1 RELAY CONNECTION Public/Granted day:2009-07-30
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