Invention Grant
- Patent Title: Ceramic capacitor and wiring board
- Patent Title (中): 陶瓷电容器和接线板
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Application No.: US12791303Application Date: 2010-06-01
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Publication No.: US08369064B2Publication Date: 2013-02-05
- Inventor: Seiji Ichiyanagi , Kenji Murakami , Motohiko Sato , Jun Otsuka , Masahiko Okuyama
- Applicant: Seiji Ichiyanagi , Kenji Murakami , Motohiko Sato , Jun Otsuka , Masahiko Okuyama
- Applicant Address: JP Nagoya
- Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Stites & Harbison PLLC
- Agent Jeffrey A. Haeberlin; Nicolo Davidson
- Priority: JP2009-132289 20090601
- Main IPC: H01G4/06
- IPC: H01G4/06 ; H01G4/005

Abstract:
A ceramic capacitor includes a capacitor body and a metal layer arranged on an outer surface of the capacitor body. The outer surface includes: a first capacitor major surface; a second capacitor major surface opposite to the first capacitor major surface in a thickness direction of the capacitor body; and a capacitor lateral surface between the first and second capacitor major surfaces. The capacitor body includes a first layer section and a second layer section. The first layer section includes a plurality of ceramic dielectric layers and a plurality of internal electrodes, wherein the ceramic dielectric layers and the internal electrodes are layered alternately. The second layer section is exposed at the first capacitor major surface, and includes a corner portion at a boundary between the first capacitor major surface and the capacitor lateral surface. The metal layer covers the corner portion of the second layer section.
Public/Granted literature
- US20100300740A1 Ceramic Capacitor and Wiring Board Public/Granted day:2010-12-02
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