Invention Grant
- Patent Title: Earphone and headset
- Patent Title (中): 耳机和耳机
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Application No.: US12427588Application Date: 2009-04-21
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Publication No.: US08369557B2Publication Date: 2013-02-05
- Inventor: Jan Peter Kuhtz , Olav Nisse , Olaf Leske
- Applicant: Jan Peter Kuhtz , Olav Nisse , Olaf Leske
- Applicant Address: DE Wedemark
- Assignee: Sennheiser electronic GmbH & Co. KG
- Current Assignee: Sennheiser electronic GmbH & Co. KG
- Current Assignee Address: DE Wedemark
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: DE102008020264 20080422
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
There is thus provided an earphone comprising a housing (20) for receiving an electroacoustic transducer, and an ear cushion unit (10) having an ear cushion material (11) and a first ring (1). The housing has a sealing ring (2) and a latching unit (21). The first ring (1) has a prestressing when it is placed on the sealing ring (2) and held by means of the latching unit (21).
Public/Granted literature
- US20090262952A1 EARPHONE AND HEADSET Public/Granted day:2009-10-22
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