Invention Grant
- Patent Title: Speaker assembly
- Patent Title (中): 扬声器组件
-
Application No.: US12826587Application Date: 2010-06-29
-
Publication No.: US08369559B2Publication Date: 2013-02-05
- Inventor: Ying-Ye Liang , Shi-Jun Yang , Ping Li , Xiao-Yong Cui
- Applicant: Ying-Ye Liang , Shi-Jun Yang , Ping Li , Xiao-Yong Cui
- Applicant Address: CN Shanghai TW New Taipei
- Assignee: Ambit Microsystems (Shanghai) Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Ambit Microsystems (Shanghai) Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shanghai TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200920317952U 20091221
- Main IPC: H04R1/02
- IPC: H04R1/02

Abstract:
A speaker assembly includes a base including two receiving holes, a cover mounted on a first surface the base, a speaker, a flexible printed circuit (FPC) attached to a second surface the base opposite to the first surface, and two springs received in the receiving holes. The cover includes a receiving space to receive the speaker. The speaker includes two first pads. The FPC includes two second pads. The springs electrically connect the first pads to the second pads.
Public/Granted literature
- US20110150263A1 SPEAKER ASSEMBLY Public/Granted day:2011-06-23
Information query