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US08369976B2 Method for compensating for tool processing variation in the routing of wafers/lots 失效
补偿晶圆/批次布线中刀具加工变化的方法

Method for compensating for tool processing variation in the routing of wafers/lots
Abstract:
A method for increasing overall yield in semiconductor manufacturing including routing wafers or wafer lots from tool to tool in a manner which at least partially neutralizes or compensates for processing variations. A system for increasing overall yield in semiconductor manufacturing includes a module for recording processing data from plural first and second types of tools and a module for routing wafers or wafer lots from tools of the first type of tools to tools of the second type of tools so as to at least partially neutralizes or compensate for processing variation.
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