Invention Grant
- Patent Title: Method for compensating for tool processing variation in the routing of wafers/lots
- Patent Title (中): 补偿晶圆/批次布线中刀具加工变化的方法
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Application No.: US12144093Application Date: 2008-06-23
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Publication No.: US08369976B2Publication Date: 2013-02-05
- Inventor: Keith Kwong Hon Wong , Xu Ouyang , Yunsheng Song
- Applicant: Keith Kwong Hon Wong , Xu Ouyang , Yunsheng Song
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Ian D. MacKinnon
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A method for increasing overall yield in semiconductor manufacturing including routing wafers or wafer lots from tool to tool in a manner which at least partially neutralizes or compensates for processing variations. A system for increasing overall yield in semiconductor manufacturing includes a module for recording processing data from plural first and second types of tools and a module for routing wafers or wafer lots from tools of the first type of tools to tools of the second type of tools so as to at least partially neutralizes or compensate for processing variation.
Public/Granted literature
- US20090319074A1 METHOD FOR COMPENSATING FOR TOOL PROCESSING VARIATION IN THE ROUTING OF WAFERS/LOTS Public/Granted day:2009-12-24
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