Invention Grant
- Patent Title: Monitoring compression of successive layers of landfill material and measurement of layer density
- Patent Title (中): 监测垃圾填埋材料连续层的压缩和层密度的测量
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Application No.: US11122925Application Date: 2005-05-05
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Publication No.: US08370067B2Publication Date: 2013-02-05
- Inventor: Mark A. Williams , Alan R. Williams
- Applicant: Mark A. Williams , Alan R. Williams
- Applicant Address: US MI Waterford
- Assignee: Geologic Computer Systems, Inc.
- Current Assignee: Geologic Computer Systems, Inc.
- Current Assignee Address: US MI Waterford
- Agency: Quinn Law Group, PLLC
- Main IPC: G01V3/38
- IPC: G01V3/38 ; G01B5/00 ; G01B5/18 ; G01B5/20
Abstract:
A method and system and the use of a 3-D positioning system for monitoring a landfill and landfill material added thereto and undergoing compaction and measures in real time the relative density of the compressed landfill material. The method and system calculates thickness, volume, density during the landfill operation to ensure that the landfill is comprised of compacted layers of substantially optimized density.
Public/Granted literature
- US20120173202A1 Monitoring compression of successive layers of landfill material and measurement of layer density Public/Granted day:2012-07-05
Information query
