Invention Grant
- Patent Title: Constructing mapping between model parameters and electrical parameters
- Patent Title (中): 构建模型参数与电参数之间的映射
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Application No.: US12871683Application Date: 2010-08-30
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Publication No.: US08370774B2Publication Date: 2013-02-05
- Inventor: Chen-Ming Tsai , Ke-Wei Su , Cheng Hsiao , Min-Chie Jeng , Jia-Lin Lo , Feng-Ling Hsiao , Yi-Shun Huang
- Applicant: Chen-Ming Tsai , Ke-Wei Su , Cheng Hsiao , Min-Chie Jeng , Jia-Lin Lo , Feng-Ling Hsiao , Yi-Shun Huang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F17/16 ; G06F17/10
Abstract:
A method includes determining a mapping between model parameters and electrical parameters of integrated circuits. The model parameters are configured to be used by a simulation tool. A set of electrical parameters is provided, and the mapping is used to map the set of electrical parameters to a set of model parameters.
Public/Granted literature
- US20120054709A1 Constructing Mapping Between Model Parameters and Electrical Parameters Public/Granted day:2012-03-01
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