Invention Grant
US08370777B2 Method of generating a leadframe IC package model, a leadframe modeler and an IC design system
失效
生成引线框IC封装模型的方法，引线框建模器和IC设计系统
- Patent Title: Method of generating a leadframe IC package model, a leadframe modeler and an IC design system
- Patent Title (中): 生成引线框IC封装模型的方法，引线框建模器和IC设计系统
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Application No.: US12485238Application Date: 2009-06-16
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Publication No.: US08370777B2Publication Date: 2013-02-05
- Inventor: Donald E. Hawk, Jr. , Stephen M. King , Jeffrey M. Klemovage , John J. Krantz , Allen S. Lim , Ashley Rebelo , Richard J. Sergi
- Applicant: Donald E. Hawk, Jr. , Stephen M. King , Jeffrey M. Klemovage , John J. Krantz , Allen S. Lim , Ashley Rebelo , Richard J. Sergi
- Applicant Address: US CA Milpitas
- Assignee: LSI Corporation
- Current Assignee: LSI Corporation
- Current Assignee Address: US CA Milpitas
- Main IPC: G06F9/455
- IPC: G06F9/455 ; G06F17/50
Abstract:
A method of generating a model of a leadframe IC package, a leadframe modeler and an IC design system are disclosed. In one embodiment the method includes: (1) adding connectivity information to a geometric representation of a leadframe, wherein the connectivity information represents electrical connections between the IC die and leads of the leadframe and (2) formatting the leads to represent BGA point of contacts for the IC die.
Public/Granted literature
- US20100318340A1 METHOD OF GENERATING A LEADFRAME IC PACKAGE MODEL, A LEADFRAME MODELER AND AN IC DESIGN SYSTEM Public/Granted day:2010-12-16
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