Invention Grant
- Patent Title: Cutting equipment
- Patent Title (中): 切割设备
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Application No.: US12876088Application Date: 2010-09-03
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Publication No.: US08371197B2Publication Date: 2013-02-12
- Inventor: Feng-Chi Lee , Kuo-chuan Chiu
- Applicant: Feng-Chi Lee , Kuo-chuan Chiu
- Applicant Address: TW Tu Cheng, Taipei
- Assignee: Cheng Uei Precision Industry Co., Ltd.
- Current Assignee: Cheng Uei Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu Cheng, Taipei
- Agent Cheng-Ju Chiang
- Main IPC: B26D7/06
- IPC: B26D7/06

Abstract:
Provided is a cutting equipment for automatically cutting off workpieces from a material tape. The cutting equipment includes an electrical control box, a base board, a material-feeding mechanism, a material-transferring mechanism, a material-pulling mechanism and a cutting mechanism. The material-feeding mechanism includes a supporting bracket, a material disc and a disc-driving device. The material-transferring mechanism mounted on the base board includes a pad board, a first supporting board and a second supporting board. The material-pulling mechanism disposed above the material-transferring mechanism includes a driving component and a material-pulling component. The cutting mechanism mounted on the base board includes a lower supporting plate, an upper cutting plate and a transferring cylinder. The upper cutting plate disposes at least one cutting blade. The cutting equipment can enhance the working efficiency, reduce the defective rate and the manufacture cost, lighten the labor intensity of operators, and be suitable for mass production.
Public/Granted literature
- US20120055304A1 CUTTING EQUIPMENT Public/Granted day:2012-03-08
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