Invention Grant
- Patent Title: Headphones
- Patent Title (中): 耳机
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Application No.: US13182935Application Date: 2011-07-14
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Publication No.: US08371417B2Publication Date: 2013-02-12
- Inventor: Takayuki Miyazawa
- Applicant: Takayuki Miyazawa
- Applicant Address: JP Yokohama-Shi, Kanagawa
- Assignee: JVC Kenwood Corporation
- Current Assignee: JVC Kenwood Corporation
- Current Assignee Address: JP Yokohama-Shi, Kanagawa
- Agency: Renner, Kenner, Greive, Bobak, Taylor & Weber
- Priority: JP2010-164707 20100722
- Main IPC: H04R5/033
- IPC: H04R5/033 ; H04R5/00

Abstract:
In a headphone set, a speaker is enclosed in a housing. A cord is connected to the speaker at one end and running to the outside of the housing at another end through a pulling-out portion of the housing. The cord is inserted into a bushing at the pulling-out portion. An outer-shape expansion portion is fixed to the cord and located between the speaker and the bushing. The outer-shape expansion portion expands the outer shape of the cord. A concavity is provided to the bushing at one end of the bushing closer to the speaker. At least a portion of the outer-shape expansion portion is put in the concavity.
Public/Granted literature
- US20120018243A1 HEADPHONES Public/Granted day:2012-01-26
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