Invention Grant
- Patent Title: Modular printhead assembly with series of connected PCB modules
- Patent Title (中): 具有串联PCB模块的模块化打印头组件
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Application No.: US12642832Application Date: 2009-12-20
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Publication No.: US08371678B2Publication Date: 2013-02-12
- Inventor: Kia Silverbrook , Norman Michael Berry , Garry Raymond Jackson , Akira Nakazawa
- Applicant: Kia Silverbrook , Norman Michael Berry , Garry Raymond Jackson , Akira Nakazawa
- Applicant Address: IE Dublin
- Assignee: Zamtec Ltd
- Current Assignee: Zamtec Ltd
- Current Assignee Address: IE Dublin
- Agency: Cooley LLP
- Main IPC: B41J2/05
- IPC: B41J2/05

Abstract:
The invention provides for a printhead assembly that has a number of modular PCBs and a number of printhead integrated circuits (ICs). Each of the printhead IC's is respectively connected to one of the modular PCBs for operative control. Modular supports in the assembly define a raised portion and a recessed portion at an end thereof. Each PCB has electrical connecting strips which operatively overlie the respective recessed portions. At least one connecting member operatively connects respective PCBs to each other. Each connecting member has a series of parallel spaced conducting strips. The member is shaped and configured for fitment into a cavity defined by the raised and recessed portions of two abutting supports to connect the connecting strips of two PCBs via the conducting strips. The assembly also has a printer controller configured to synchronize operation of the respective PCBs during printing.
Public/Granted literature
- US20100091069A1 Modular Printhead Assembly With Series Of Connected PCB Modules Public/Granted day:2010-04-15
Information query
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