Invention Grant
- Patent Title: Liquid ejecting head unit and liquid ejecting apparatus
- Patent Title (中): 液体喷射头单元和液体喷射装置
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Application No.: US12683359Application Date: 2010-01-06
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Publication No.: US08371679B2Publication Date: 2013-02-12
- Inventor: Yoshinao Miyata , Hiroshige Owaki , Kazutoshi Goto
- Applicant: Yoshinao Miyata , Hiroshige Owaki , Kazutoshi Goto
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2009-002960 20090108
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
There is provided a liquid ejecting head unit that includes a liquid ejecting head ejecting liquid by driving a pressure generating element. The liquid ejecting head unit includes: the liquid ejecting head that includes first wiring substrates each having a connection wiring electrically connected to the pressure generating element and a support member that supports at least two first wiring substrates in different positions; a second wiring substrate that is commonly connected to the connection wirings of a plurality of the first wiring substrates electrically; and a head substrate to which the second wiring substrate is electrically connected. A connection portion connected to the head substrate is aligned on one face side of the second wiring substrate.
Public/Granted literature
- US20100171794A1 LIQUID EJECTING HEAD UNIT AND LIQUID EJECTING APPARATUS Public/Granted day:2010-07-08
Information query
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