Invention Grant
US08371838B2 Method and device for placing thin material layers onto a relief mould
失效
将薄材料层放置在浮雕模具上的方法和装置
- Patent Title: Method and device for placing thin material layers onto a relief mould
- Patent Title (中): 将薄材料层放置在浮雕模具上的方法和装置
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Application No.: US13229506Application Date: 2011-09-09
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Publication No.: US08371838B2Publication Date: 2013-02-12
- Inventor: Ulrich Eberth , Hans-Martin Krafft , Martin Friedrich
- Applicant: Ulrich Eberth , Hans-Martin Krafft , Martin Friedrich
- Applicant Address: DE Hamburg DE Cologne
- Assignee: Airbus Deutschland GmbH,Deutsches Zentrum fuer Luft-und Raumfahrt E.V. (DLR)
- Current Assignee: Airbus Deutschland GmbH,Deutsches Zentrum fuer Luft-und Raumfahrt E.V. (DLR)
- Current Assignee Address: DE Hamburg DE Cologne
- Agency: Ingrassia Fisher & Lorenz P.C.
- Priority: DE102005044823 20050920
- Main IPC: B28B11/08
- IPC: B28B11/08

Abstract:
The present invention relates to a method and a device for placing at least one material layer onto a relief mold for producing a composite material. Thereby, an elastically-reversibly deformable body with a surface relief that is designed to correspond to the relief mold is pressed against the material layer, as a result of which the surface of said body is deformed, and the material layer can be picked up. As a result of its elastically-reversible characteristics the body subsequently deforms back to its initial state so that the material layer can easily be placed onto the relief mold.
Public/Granted literature
- US20110318445A1 METHOD AND DEVICE FOR PLACING THIN MATERIAL LAYERS ONTO A RELIEF MOULD Public/Granted day:2011-12-29
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