A connector assembly utilizes capacitive coupling for connecting two substrates. The connector assembly includes first and second connector frames which may be respectively attached to first and second substrates. The first connector frame includes a plurality of first conductors connected to circuits on the first circuit substrate and these conductors have exposed contact surfaces with a dielectric material disposed thereon. The first conductors and associated dielectric material confront second, opposing conductors supported by the second connector frame when the connector frames are engaged together. The first connector frame has a recess formed therein so that its conductors and dielectric material are arranged at a level beneath the top surface of the first connector frame. This recess defines a reservoir and a liquid dielectric material is interposed between the terminals and the dielectric portions in the reservoir, which prevents the liquid dielectric from flowing off the first conductors and dielectric material.