Invention Grant
- Patent Title: Increased density connector system
- Patent Title (中): 增加密度连接器系统
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Application No.: US12712052Application Date: 2010-02-24
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Publication No.: US08371876B2Publication Date: 2013-02-12
- Inventor: Wayne Samuel Davis
- Applicant: Wayne Samuel Davis
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A connector system is provided for electrically connecting a receptacle printed circuit to a header printed circuit. The connector system includes a header assembly configured to be mounted on the header printed circuit. The header assembly includes header contacts. A receptacle assembly is configured to be mounted on the receptacle printed circuit and mated with the header assembly. The receptacle assembly includes a housing and a contact module held within the housing. The contact module has separate first and second chicklets that are coupled together to define the contact module. First and second receptacle contacts are held by the contact module and arranged in a differential pair. The first and second receptacle contacts are engaged with the header contacts of the header assembly. The first receptacle contact of the differential pair is held by the first chicklet and the second receptacle contact of the differential pair is held by the second chicklet.
Public/Granted literature
- US20110207342A1 INCREASED DENSITY CONNECTOR SYSTEM Public/Granted day:2011-08-25
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