Invention Grant
- Patent Title: Polishing with enhanced uniformity
- Patent Title (中): 抛光加强均匀性
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Application No.: US12188226Application Date: 2008-08-08
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Publication No.: US08371904B2Publication Date: 2013-02-12
- Inventor: Sunil Kumar Jindal , Arun Kumar Gupta
- Applicant: Sunil Kumar Jindal , Arun Kumar Gupta
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Horizon IP Pte Ltd
- Main IPC: B24B7/22
- IPC: B24B7/22

Abstract:
A polishing head is presented. The polishing head includes a housing having top and bottom surfaces. The housing is formed from a single piece of material. The polishing head includes grooves disposed on the bottom surface and an inlet in communication with the grooves for coupling to a pressure medium supply to supply a pressure medium to the grooves. The pressure medium when supplied to the grooves exerts pressure on a template when attached to the bottom surface to provide back side pressure on a back surface of an article when temporally attached to the template.
Public/Granted literature
- US20100035527A1 POLISHING WITH ENHANCED UNIFORMITY Public/Granted day:2010-02-11
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