Invention Grant
- Patent Title: Distensible ligament systems
- Patent Title (中): 可扩张韧带系统
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Application No.: US12412004Application Date: 2009-03-26
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Publication No.: US08372146B2Publication Date: 2013-02-12
- Inventor: Frank J. Schwab
- Applicant: Frank J. Schwab
- Applicant Address: US IN Warsaw
- Assignee: Warsaw Orthopedic, Inc.
- Current Assignee: Warsaw Orthopedic, Inc.
- Current Assignee Address: US IN Warsaw
- Main IPC: A61F2/08
- IPC: A61F2/08
Abstract:
Distensible ligaments and distensible ligament systems are provided, including apparatuses, systems, devices, hardware, methods, and combinations for distensible systems.
Public/Granted literature
- US20100249928A1 DISTENSIBLE LIGAMENT SYSTEMS Public/Granted day:2010-09-30
Information query
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