An osteoconductive backing implant for joint revisions is provided that may enhance bone healing and, for cementless implants, bony integration of the implant. The backing implant comprises a generally planar surface that may be formed into a generally hemispherical shape. In one embodiment, the backing implant comprises a disc having an inner hole and an outer edge, at least one slit extending from the inner hole to the outer edge. The disc may be formed from a coherent mass of elongate, mechanically entangled demineralized bone particles.