Invention Grant
- Patent Title: Reducing electrostatic charge by roughening the susceptor
- Patent Title (中): 通过粗化基座来减少静电电荷
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Application No.: US11182168Application Date: 2005-07-15
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Publication No.: US08372205B2Publication Date: 2013-02-12
- Inventor: Soo Young Choi , Beom Soo Park , Quanyuan Shang , John M. White , Dong-Kil Yim , Chung-Hee Park
- Applicant: Soo Young Choi , Beom Soo Park , Quanyuan Shang , John M. White , Dong-Kil Yim , Chung-Hee Park
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01L21/306
- IPC: H01L21/306 ; C23C16/00 ; C23F1/00
Abstract:
A substrate support and method for fabricating the same are provided. In one embodiment of the invention, a substrate support includes an electrically conductive body having a substrate support surface that is covered by an electrically insulative coating. At least a portion of the coating centered on the substrate support surface has a surface finish of between about 200 to about 2000 micro-inches. In another embodiment, a substrate support includes an anodized aluminum body having a surface finish on the portion of the body adapted to support a substrate thereon of between about 200 to about 2000 micro-inches. In one embodiment, a substrate support assembly includes an electrically conductive body having a substrate support surface, a substrate support structure that is adapted to support the conductive body and the conductive body is covered by an electrically insulative coating.
Public/Granted literature
- US20060032586A1 Reducing electrostatic charge by roughening the susceptor Public/Granted day:2006-02-16
Information query
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