Invention Grant
- Patent Title: Substrate treating apparatus and substrate treating method
- Patent Title (中): 基板处理装置及基板处理方法
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Application No.: US12411266Application Date: 2009-03-25
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Publication No.: US08372299B2Publication Date: 2013-02-12
- Inventor: Yasunori Nakajima , Yusuke Mori
- Applicant: Yasunori Nakajima , Yusuke Mori
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2008-078437 20080325; JP2008-314742 20081210
- Main IPC: C03C15/00
- IPC: C03C15/00

Abstract:
A method and apparatus for performing treatment of substrates with a treating liquid. A first storage unit stores an initial life count specifying an allowable number of treatments of substrates to be carried out with treating liquid after an entire liquid replacement with a new supply of the treating liquid; a second storage device stores a normal life count specifying an allowable number of treatments to be carried out with the treating liquid after reaching the initial life count and after a partial liquid replacement; and a control device repeats treatment of the substrates after the entire liquid replacement until the initial life count is reached; and after the initial life count has been reached and the partial liquid replacement has been made, repeats treatment of the substrates until the normal life count is reached, and makes the partial liquid replacement each succeeding time the normal life count is reached.
Public/Granted literature
- US20090246968A1 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD Public/Granted day:2009-10-01
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