Invention Grant
US08372495B2 Electronic device enclosure using sandwich construction 有权
电子设备外壳采用夹层结构

  • Patent Title: Electronic device enclosure using sandwich construction
  • Patent Title (中): 电子设备外壳采用夹层结构
  • Application No.: US12788062
    Application Date: 2010-05-26
  • Publication No.: US08372495B2
    Publication Date: 2013-02-12
  • Inventor: Kevin M. Kenney
  • Applicant: Kevin M. Kenney
  • Applicant Address: US CA Cupertino
  • Assignee: Apple Inc.
  • Current Assignee: Apple Inc.
  • Current Assignee Address: US CA Cupertino
  • Agency: Dorsey & Whitney LLP
  • Main IPC: B29D22/00
  • IPC: B29D22/00
Electronic device enclosure using sandwich construction
Abstract:
A housing for an electronic device or other object formed in a layered configuration. The layer or sandwich construction imparts strength and rigidity while decreasing the overall weight to the housing. The case/housing may have a first layer and a second layer formed from a first material. The case may also include a core formed from a second material. Where the first layer may be bonded to a top surface of the core and the second layer may be bonded to a bottom surface of the core.
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