Invention Grant
- Patent Title: Electronic device enclosure using sandwich construction
- Patent Title (中): 电子设备外壳采用夹层结构
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Application No.: US12788062Application Date: 2010-05-26
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Publication No.: US08372495B2Publication Date: 2013-02-12
- Inventor: Kevin M. Kenney
- Applicant: Kevin M. Kenney
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Dorsey & Whitney LLP
- Main IPC: B29D22/00
- IPC: B29D22/00

Abstract:
A housing for an electronic device or other object formed in a layered configuration. The layer or sandwich construction imparts strength and rigidity while decreasing the overall weight to the housing. The case/housing may have a first layer and a second layer formed from a first material. The case may also include a core formed from a second material. Where the first layer may be bonded to a top surface of the core and the second layer may be bonded to a bottom surface of the core.
Public/Granted literature
- US20110290685A1 ELECTRONIC DEVICE ENCLOSURE USING SANDWICH CONSTRUCTION Public/Granted day:2011-12-01
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