Invention Grant
- Patent Title: RTP heating system and method
- Patent Title (中): RTP加热系统及方法
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Application No.: US13004654Application Date: 2011-01-11
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Publication No.: US08372683B2Publication Date: 2013-02-12
- Inventor: Shiezen Steven Huang
- Applicant: Shiezen Steven Huang
- Applicant Address: WS Apia
- Assignee: ADPV Technology Limited
- Current Assignee: ADPV Technology Limited
- Current Assignee Address: WS Apia
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW99121872A 20100702
- Main IPC: H01L31/18
- IPC: H01L31/18

Abstract:
An RTP heating system and an RTP heating method, which can heat a photovoltaic-device intermediate product having a glass substrate, a Mo layer, and a light absorption layer in formation. The RTP heating system is composed of a chamber; a support member located in the chamber; a heating element mounted in the chamber for emitting infrared rays for heating; and a plurality of temperature sensors and a temperature control device for sensing and controlling thermal sources from the heating element and the support member. The infrared rays can be mostly reflected off the Mo layer to apply less direct heating to the glass substrate. Accordingly, the upper and lower surfaces of the photovoltaic-device intermediate product can be heated under different temperatures separately to prevent the glass substrate below the photovoltaic-device intermediate product from softening and deformation and to allow production of the light absorption layer on the Mo layer.
Public/Granted literature
- US20120003774A1 RTP HEATING SYSTEM AND METHOD Public/Granted day:2012-01-05
Information query
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