Invention Grant
US08372717B2 Method for manufacturing a super-junction trench MOSFET with resurf stepped oxides and trenched contacts
有权
制造具有复合阶梯氧化物和沟槽触点的超结沟槽MOSFET的方法
- Patent Title: Method for manufacturing a super-junction trench MOSFET with resurf stepped oxides and trenched contacts
- Patent Title (中): 制造具有复合阶梯氧化物和沟槽触点的超结沟槽MOSFET的方法
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Application No.: US13299648Application Date: 2011-11-18
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Publication No.: US08372717B2Publication Date: 2013-02-12
- Inventor: Fu-Yuan Hsieh
- Applicant: Fu-Yuan Hsieh
- Applicant Address: TW
- Assignee: Force Mos Technology Co., Ltd.
- Current Assignee: Force Mos Technology Co., Ltd.
- Current Assignee Address: TW
- Agency: Bacon & Thomas, PLLC
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A method of manufacturing a super junction semiconductor device having resurf stepped oxide structure is disclosed by providing semiconductor silicon layer having trenches and mesas. A plurality of first doped column regions of a second conductivity type in parallel surrounded with second doped column regions of a first conductivity type adjacent to sidewalls of the trenches are formed by angle ion implantations into a plurality of mesas through opening regions in a block layer covering both the mesas and a termination area.
Public/Granted literature
- US20120064684A1 METHOD FOR MANUFACTURING A SUPER-JUNCTION TRENCH MOSFET WITH RESURF STEPPED OXIDES AND TRENCHED CONTACTS Public/Granted day:2012-03-15
Information query
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