Invention Grant
US08372717B2 Method for manufacturing a super-junction trench MOSFET with resurf stepped oxides and trenched contacts 有权
制造具有复合阶梯氧化物和沟槽触点的超结沟槽MOSFET的方法

Method for manufacturing a super-junction trench MOSFET with resurf stepped oxides and trenched contacts
Abstract:
A method of manufacturing a super junction semiconductor device having resurf stepped oxide structure is disclosed by providing semiconductor silicon layer having trenches and mesas. A plurality of first doped column regions of a second conductivity type in parallel surrounded with second doped column regions of a first conductivity type adjacent to sidewalls of the trenches are formed by angle ion implantations into a plurality of mesas through opening regions in a block layer covering both the mesas and a termination area.
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