Invention Grant
US08372731B2 Device fabrication by ink-jet printing materials into bank structures, and embossing tool
有权
通过喷墨印刷材料制成银行结构的装置和压花工具
- Patent Title: Device fabrication by ink-jet printing materials into bank structures, and embossing tool
- Patent Title (中): 通过喷墨印刷材料制成银行结构的装置和压花工具
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Application No.: US11714098Application Date: 2007-03-06
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Publication No.: US08372731B2Publication Date: 2013-02-12
- Inventor: Shunpu Li , Christopher Newsome , David Russell , Thomas Kugler
- Applicant: Shunpu Li , Christopher Newsome , David Russell , Thomas Kugler
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: GB0604925.8 20060310
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
The invention disclosed relates to the fabrication of electronic devices. A method for fabricating an electronic device is disclosed, comprising embossing a surface of a work-piece 200, 202 using an embossing tool 204, so as to form a microstructure having at least two levels of thickness contrast on the work-piece surface, and depositing fluid 208 containing a functional material onto the microstructure. In a preferred embodiment, the step of depositing fluid 208 comprises ink-jet printing. An embossing tool 204 for creating a microstructure on a work-piece 200, 202 is also disclosed, the embossing tool 204 comprising a first surface and steps of at least two different heights relative to the first surface.
Public/Granted literature
- US20070287270A1 Device fabrication by ink-jet printing materials into bank structures, and embossing tool Public/Granted day:2007-12-13
Information query
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