Invention Grant
US08372792B2 Cleaner composition for removing lead-free soldering flux, and method for removing lead-free soldering flux
有权
用于去除无铅焊剂的清洁剂组合物,以及去除无铅焊剂的方法
- Patent Title: Cleaner composition for removing lead-free soldering flux, and method for removing lead-free soldering flux
- Patent Title (中): 用于去除无铅焊剂的清洁剂组合物,以及去除无铅焊剂的方法
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Application No.: US12668798Application Date: 2008-08-08
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Publication No.: US08372792B2Publication Date: 2013-02-12
- Inventor: Takashi Tanaka , Kazutaka Zenfuku
- Applicant: Takashi Tanaka , Kazutaka Zenfuku
- Applicant Address: JP Osaka-shi
- Assignee: Arakawa Chemical Industries, Ltd.
- Current Assignee: Arakawa Chemical Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2007-207107 20070808; JP2008-18852 20080130
- International Application: PCT/JP2008/064275 WO 20080808
- International Announcement: WO2009/020199 WO 20090212
- Main IPC: C11D7/50
- IPC: C11D7/50

Abstract:
The object of the present invention is to provide a novel cleaner composition that not only reduces ignition by flame and has a small influence on the environment, but that also has an excellent property of dissolving flux residues adhered on narrow portions or in narrow gaps in an object to be cleaned that was subjected to soldering with a lead-free solder, and reduces recontamination of the object in the water-rinsing process. The present invention uses a halogen-free organic solvent (A) represented by a specific Formula; an amine-based compound (B) represented by a specific Formula; a chelating agent having no amino group (C); and, as required, water.
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