Invention Grant
- Patent Title: Total etch dental adhesive composition
- Patent Title (中): 总蚀刻牙科粘合剂组合物
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Application No.: US12319949Application Date: 2009-01-13
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Publication No.: US08372896B2Publication Date: 2013-02-12
- Inventor: Joachim E. Klee , Uwe Lehmann , Franziska Heinzmann
- Applicant: Joachim E. Klee , Uwe Lehmann , Franziska Heinzmann
- Applicant Address: US PA York
- Assignee: DENTSPLY International Inc.
- Current Assignee: DENTSPLY International Inc.
- Current Assignee Address: US PA York
- Agent David A. Zdurne; Douglas J. Hura; Leana Levin
- Main IPC: A61K6/00
- IPC: A61K6/00 ; A61K6/083 ; A61F2/00 ; A61L24/00
Abstract:
Dental adhesive composition having a pH of at least 5, which comprises an aqueous solution containing (a) a polymerizable N-substituted alkyl acrylic or acrylic acid amide monomer; (b) a water-soluble polymerizable carboxylic acid; and (c) a water-soluble organic solvent.
Public/Granted literature
- US20100179244A1 Total etch dental adhesive composition Public/Granted day:2010-07-15
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