Invention Grant
- Patent Title: Electronic device enclosure
- Patent Title (中): 电子设备外壳
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Application No.: US12869711Application Date: 2010-08-26
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Publication No.: US08373077B2Publication Date: 2013-02-12
- Inventor: Zhi-Bin Guan
- Applicant: Zhi-Bin Guan
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99125037A 20100729
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An electronic device enclosure includes a side panel defining a number of vents. Each vent is sandwiched by two adjacent partition members for preventing moisture penetrating the enclosure. Each of the partition members includes a plate, a first block perpendicularly extending from a first end of the plate, and a second block perpendicularly extending from a second end of the plate opposite to the first end. The first and second blocks extend in opposite directions.
Public/Granted literature
- US20120024594A1 ELECTRONIC DEVICE ENCLOSURE Public/Granted day:2012-02-02
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