Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12901734Application Date: 2010-10-11
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Publication No.: US08373207B2Publication Date: 2013-02-12
- Inventor: Shigeru Kusunoki , Shinichi Ishizawa
- Applicant: Shigeru Kusunoki , Shinichi Ishizawa
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-285233 20091216
- Main IPC: H01L29/80
- IPC: H01L29/80

Abstract:
A semiconductor device includes: a rectifying element; an electrode pad electrically connected to the rectifying element; and a resistance and a depletion transistor arranged between the rectifying element and the electrode pad, and electrically connected to each other. The semiconductor device has a configuration in which the rectifying element, the resistance, the depletion transistor, and the electrode pad are serially connected. The semiconductor device is configured to generate a gate potential of the depletion transistor based on a difference in potential across the resistance and to produce a depletion layer in a channel of the depletion transistor based on the gate potential. As a result, a semiconductor device having reasonably large current at low voltage and small current at high voltage can be obtained.
Public/Granted literature
- US20110140179A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-06-16
Information query
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