Invention Grant
US08373208B2 Lateral super junction device with high substrate-gate breakdown and built-in avalanche clamp diode
有权
具有高基板栅极击穿和内置雪崩钳位二极管的横向超接点器件
- Patent Title: Lateral super junction device with high substrate-gate breakdown and built-in avalanche clamp diode
- Patent Title (中): 具有高基板栅极击穿和内置雪崩钳位二极管的横向超接点器件
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Application No.: US12799810Application Date: 2010-04-30
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Publication No.: US08373208B2Publication Date: 2013-02-12
- Inventor: Madhur Bobde , Lingpeng Guan , Anup Bhalla , Hamza Yilmaz
- Applicant: Madhur Bobde , Lingpeng Guan , Anup Bhalla , Hamza Yilmaz
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee Address: US CA Sunnyvale
- Agent Bo-In Lin
- Main IPC: H01L21/8232
- IPC: H01L21/8232

Abstract:
A lateral super junction JFET is formed from stacked alternating P type and N type semiconductor layers over a P-epi layer supported on an N+ substrate. An N+ drain column extends down through the super junction structure and the P-epi to connect to the N+ substrate to make the device a bottom drain device. N+ source column and P+ gate column extend through the super junction but stop at the P-epi layer. A gate-drain avalanche clamp diode is formed from the bottom the P+ gate column through the P-epi to the N+ drain substrate.
Public/Granted literature
- US20110127586A1 Lateral super junction device with high substrate-gate breakdown and built-in avalanche clamp diode Public/Granted day:2011-06-02
Information query
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