Invention Grant
- Patent Title: Semiconductor device and method for forming the same
- Patent Title (中): 半导体装置及其形成方法
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Application No.: US12649637Application Date: 2009-12-30
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Publication No.: US08373234B2Publication Date: 2013-02-12
- Inventor: Jeong Hoon Park , Dong Sauk Kim
- Applicant: Jeong Hoon Park , Dong Sauk Kim
- Applicant Address: KR Kyoungki-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Kyoungki-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2009-0121764 20091209
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
A semiconductor device includes a structure in which a difference in height between a cell region and a peripheral region are formed so that a buried gate structure of the cell region is substantially equal in height to the gate of the peripheral region, whereby a bit line and a storage node contact can be more easily formed in the cell region and parasitic capacitance can be decreased. The semiconductor device includes a cell region including a gate buried in a substrate, and a peripheral region adjacent to the cell region, where a step height between a surface of the cell and a surface of the peripheral region is generated.
Public/Granted literature
- US20110133283A1 SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME Public/Granted day:2011-06-09
Information query
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