Invention Grant
- Patent Title: Linear-cap varactor structures for high-linearity applications
- Patent Title (中): 线性可变电抗器结构,用于高线性应用
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Application No.: US12858291Application Date: 2010-08-17
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Publication No.: US08373248B2Publication Date: 2013-02-12
- Inventor: Chia-Chung Chen , Chewn-Pu Jou
- Applicant: Chia-Chung Chen , Chewn-Pu Jou
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/08
- IPC: H01L29/08

Abstract:
A device includes a well region over a substrate, and a heavily doped well region over the well region, wherein the well region and the heavily doped well region are of a same conductivity type. A gate dielectric is formed on a top surface of the heavily doped well region. A gate electrode is formed over the gate dielectric. A source region and a drain region are formed on opposite sides of the heavily doped well region. The source region and the drain region have bottom surfaces contacting the well region, and wherein the source region and the drain region are of opposite conductivity types.
Public/Granted literature
- US20120043590A1 Linear-Cap Varactor Structures for High-Linearity Applications Public/Granted day:2012-02-23
Information query
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